Power dissipation is an important issue in today's printed circuit board design. Power dissipation will result in temperature difference and pose a thermal problem to a chip. In addition to the issue of reliability, excess heat will also negatively affect electrical performance and safety. The working temperature of an IC should therefore be kept below the maximum allowable limit of the worst case. Common junction and ambient temperatures are 125 and 55 degree Celsius respectively.

The ever-shrinking chip size causes the heat to concentrate within a small area and leads to high power density. In addition, denser transistors gathering in a monolithic chip and higher operating frequency cause a worsening of the power dissipation. Removing the heat effectively becomes the critical issue to be resolved.

Deftronics can help you solve your potential thermal issues on your printed circuit board. Working with you, our consultants can plan, manage and execute a complete thermal analysis project for you, ensuring that you get practical solutions within your schedule and budget.