The back-end of the EDA design process is generally under most pressure to release a product on time. This is the last opportunity to implement development changes before the design becomes a physical product, the part when all the key issues need to be put together and addressed. In general, success/quality not only depends on the designer and knowing how to work with the layout-tool but also on the various interfaces tool and use of signal simulation, PDM, DFM tooling, PCBA ICT testing methodology, PCBA Boundary Scan (BS) testing and, last but not least, front end data entry tooling.

Deftronics has extensive experience in PCB design in a high technology environment ranging from small controller paddleboards to very dense, high-speed electronic telecommunications boards.

Deftronics supports multiple PCB design/analysis platforms including Cadence Allegro, Mentor Graphics and Mentor Power PCB,Protel…
Our development methodology allows customers to review milestones after each critical point in the design process.
With years of experience, our designers can handle the most complex designs in board design services.

Our Board Design team offers a unique combination of: Extensive domain knowledge in areas such as computings, mobile communications, telecommunication, networking and consumer
systems. Design expertise in high speed, multi-layer and high performance boards. Well-defined & proven design methodologies with clearly outlined internal guidelines and review processes.

Wide-ranging capabilities which include interconnections for 10Gb/s signals, excellent skills for using a good number of FPGAs/BGAs/uBGAs on Board, experience in Analog Designs and Mixed technology boards.

Exposure to leading edge EDA tools & capabilities in related technology areas such as:                                                           

1.Multi-layer technology
2. Micro via technology
3. Blind/Buried via technology
4. Micro BGA fan-out and routing
5. Differential pair routing
6. Matched net length routing
7. Impedance control
8. Power distribution
9. Signal integrity analysis
10. EMI/EMC/EMI analysis
11. Power integrity analysis
12. Thermal analysis
13. DFM/DFT/DFA analysis
14.Dedicated EDA footprint library creation & maintenance